| 摘要 |
PROBLEM TO BE SOLVED: To exclude restriction of the order of bonding junction and increase freedom of board design, by setting an arbitrary point of a board pattern as a start point, and performing bonding and joining in the order of an electrode part of an electronic component and other arbitrary points of the board pattern. SOLUTION: A pattern 3 is so formed that, when two arbitrary points of other board pattern 3 are connected by a wire bonder tool, an electrode part 1a of an electronic component 1 is arranged in an intermediate part of the two points. Firstly, one end portion of a bonding wire 4 is made to abut against one junction part 3a of the pattern 3, and the junction part 3a is bonding-joined by ultrasonic wave or the like. Secondly, the bonding-joined junction part 3a is set as a start point, the wire 4 is stretched and guided to the electrode part 1a, and bonding and joining are performed at the electrode part 1a. Thirdly, the wire 4 is stretched and guided to the other junction part 3b of the pattern 3, and bonding and joining are performed in the junction part 3b. Surplus wire 4 is cut at a point shown by an arrow A. |
