| 摘要 |
PROBLEM TO BE SOLVED: To realize reduction in the cost of semiconductor devices, enhancement in the yield of the devices and an increase in the mounting efficiency of the devices, by decreasing as much as possible, a semiconductor device manufacture man-hours to take to the time when the semiconductor devices are housed in a carrier for a semiconductor device, which is housed with the semiconductor devices having a chip-sized package structure and holds the devices. SOLUTION: In a carrier for semiconductor device, which holds a plurality of semiconductor devices 12A of a constitution, in which a molding resin 14 is formed on at least a circuit surface on a wafer 11 formed with a plurality of semiconductor elements 13, and at the same time, bumps 15A for mounting are provided in batch on the circuit surface, a ring frame 20A installed in such a way as to encircle the wafer 11 (the plurality of the semiconductor devices 12A) and is connected with this wafer 11 via the resin 14, and a tape material 21 which is held by this ring frame 20A and bonded to the bumps 15A are provided. |
