| 摘要 |
PROBLEM TO BE SOLVED: To provide a package for high-frequency circuit, which is low in the reflection losses in the input/output part of a high-frequency signal, can also be shielded from electromagnetic waves and has low-loss transmission characteristics for the high-frequency signal. SOLUTION: This package is for the high-frequency circuit of a structure, wherein the package is provided with an insulating board 21, having a lower ground conductor layer 26 and a mounting part 21a for a high-frequency circuit component 28, a line conductor 24 and the same surface ground conductor layers 25, which are provided from the vicinity of the mounting part 21a, extending over the vicinity of the outer periphery of the mounting part 21a, and an insulating frame body 22, which is bonded on the board 21 and is formed with an upper ground conductor layer 27, and with castellation conductors 32, which connect the layers 25 with the layer 27, formed on the inner and outer side surfaces of the frame body 22, through conductors, which connect the layers 25 with the layer 26 are respectively formed in the parts, which are located directly under the conductors 32 of the insulating board 21. The ground state of the package is stable, and the reflection loss and radiation loss of the package can be reduced. |
