| 摘要 |
In a method of mounting an electronic component onto a printed circuit board by reflow mounting, the electronic component having a plurality of connection leads protruding from the component, a plurality of strips of solder are applied on a group of pads arranged in a line on the printed circuit board. The pads are disposed on the circuit in correspondence to the connection leads, and the connection leads of the electronic component are bonded to the corresponding pads by reflow soldering. By applying solder in strips, their widths need not be excessive, thereby avoiding solder bridging.
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