| 摘要 |
<p>A method of manufacturing multilayer printed wiring board is disclosed. In the described method, respective layers of a multilayer printed wiring board are formed with respective printed wiring boards (2, 3, 5 and 7), respective printed wiring boards are laminated and pasted up, and necessary circuits of the printed wiring board are electrically connected by means of through-holes (12, 13, 14) punched into the respective printed wiring boards. The method comprises the steps of: inserting a plurality of fine wires (16) into respective through-holes punched in the respective printed wiring boards; filling up solder (17) into the through-holes of the connecting lands by capillary action; and electrically connecting the necessary circuits between the respective printed wiring boards (2, 3, 5 and 7) with each other. <IMAGE></p> |
