| 发明名称 |
PROCESS AND MANUFACTURING TOOL ARCHITECTURE FOR USE IN THE MANUFACTURE OF ONE OR MORE METALLIZATION LEVELS ON A WORKPIECE |
| 摘要 |
A semiconductor manufacturing tool configuration and corresponding process for applying one or more levels of interconnect metallization to a generally planar dielectric surface of a semiconductor workpiece with a minimal number of workpiece transfer operations between the tool sets is disclosed. |
| 申请公布号 |
WO9959190(A2) |
申请公布日期 |
1999.11.18 |
| 申请号 |
WO1999US10331 |
申请日期 |
1999.05.12 |
| 申请人 |
SEMITOOL, INC. |
发明人 |
STEVENS, E., HENRY;BERNER, ROBERT, W. |
| 分类号 |
H01L21/302;C12N15/31;H01L21/304;H01L21/306;H01L21/3065;H01L21/3213;H01L21/768;H01L37/00 |
主分类号 |
H01L21/302 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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