发明名称
摘要 <p>PURPOSE:To shorten wiring length and to reduce noise, by employing a series of processes in which some resistors formed in a chip are directly connected to the elements within an LSI on the chip, and the remaining resistors are connected at the respective one ends as the output terminals of a board to any element within the LSI through wirings outside the board. CONSTITUTION:Resistors 4 are connected to most of the through holes 2, which are bored through a board 1 of insulator, through wirings 3, and such resistors 4 are connected by both a power layer 6 and the through holes 2. And, when resistors are put to use, some resistors 4 are connected to an LSI chip through solder, further the remaining resistors 5 are selectively connected to the wiring board through solder. As a result, for the specific terminal resistors, the wiring length to the LSI chip can be shortened and the wiring capacity can be decreased to reduce the signal noise. Moreover, the remaining resistors may be connected to any element within the LSI chip, which enables the connection between elements within the LSI or the connection between elements of one LSI and the other LSI to be freely performed.</p>
申请公布号 JPH07120570(B2) 申请公布日期 1995.12.20
申请号 JP19870272053 申请日期 1987.10.28
申请人 发明人
分类号 H01L23/12;H01C7/00;H01C13/00;H01L25/00;(IPC1-7):H01C13/00 主分类号 H01L23/12
代理机构 代理人
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