摘要 |
<p>Low-thermal-expansivity polyimides have a linear rigid skeleton, so that adhesion between perfectly cured low-thermal-expansivity polyimide films is very low. On the other hand, a film of a polyimide (2, 4, 6) having a flexible skeleton shows high adhesiveness even after perfect curing, so that it is possible to enhance adhesion between the low-thermal-expansivity polyimide films (3, 7) by interposing a polyimide having a flexible skeleton. A flexible polyimide thin film (2, 4, 6) is formed as a highly adhesive film on a low-thermal-expansivity polyimide film (3, 7) n a half-cured state, then metallic wiring (5) is applied thereon, followed by formation of another highly adhesive thin film (2, 4, 6) in a half-cured state, and then a low-thermal-expansivity polyimide film (3, 7) is further formed thereon. It is possible to provide a multilayer wiring structure which has improved adhesion between the low-thermal-expansivity polyimide film (3, 7) and the wiring pattern layer (5) or the substrate. <IMAGE></p> |
申请人 |
HITACHI, LTD., TOKIO/TOKYO, JP |
发明人 |
TAWATA, RIE, HITACHI-SHI, JP;NUMATA, SHUNICHI, HITACHI-SHI, JP;MIWA, TAKAO, HITACHI-SHI, JP;FUJISAKI, KOJI, HITACHI-SHI, JP;IKEDA, TAKAYOSHI, NAKA-GUN, IBARAKI-KEN, JP;OKABE, YOSHIAKI, HITACHI-SHI, JP;SHIMANOKI, HISAE, HITACHI-SHI, JP |