| 摘要 |
<p>PROBLEM TO BE SOLVED: To raise the strength of connection terminals enough to accurately and stably electrically connect electrodes of semiconductor devices to specified external electric circuits for a long time by adding auxiliary openings to portions of recesses of an insulation substrate to form the connection terminals. SOLUTION: Recesses 1b having approximately circular openings are formed into at least one main surface of an insulation substrate 1 and mounting area 1a for mounting semiconductor element 3 is formed at the other or one main surface. Wiring layers 5 are led from the periphery of the area 1a to the bottoms of the recesses 1b to form pads 7 electrically connected to the wiring layers 5 in the recesses 1b. Connection terminals 8 having approximately spherical protrusions 8a are provided on one main surface of the substrate 1 and bonded to the pads 7. Suck package 4 has auxiliary openings A added to portions of the openings of the recesses 1b; the width of the opening A is a half the diameter D of the opening or less.</p> |
