发明名称 |
Multilayer board having insulating isolation rings |
摘要 |
A structure includes a support layer formed of a conductive material, such as a sheet of copper. The support layer has a number of conductive islands isolated from other portions of the support layer by isolation gaps. The support layer is sandwiched between two compound layers each of which is formed of a dielectric layer having a number of via holes and conductive elements located in the via holes. The conductive elements are formed at predetermined locations such that a conductive element in each compound layer contacts a conductive island in the support layer. The structure also includes two conductive layers formed on the two respective compound layers such that a trace in a first conductive layer is coupled to a trace in a second conductive layer through two conductive elements in the respective two compound layers and an island in the support layer. Such a structure can be formed by a number of processes. For example, the support layer can be formed by etching a sheet of conductive material, the compound layers can be formed by placing a conductive paste in via holes in a dielectric layer, and the conductive layers can be formed by lamination followed by etching to form traces.
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申请公布号 |
US5872338(A) |
申请公布日期 |
1999.02.16 |
申请号 |
US19960631875 |
申请日期 |
1996.04.10 |
申请人 |
PROLINX LABS CORPORATION |
发明人 |
LAN, JAMES J. D.;CHIANG, STEVE S.;WU, PAUL Y. F.;XIE, JOHN Y. |
分类号 |
H01L21/48;H01L23/498;H05K3/06;H05K3/20;H05K3/40;H05K3/44;(IPC1-7):H05K1/03 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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