| 摘要 |
PROBLEM TO BE SOLVED: To provide a hybrid type information recording medium of little warping. SOLUTION: A transparent base, an optical recording layer and an IC module are disposed in said order, and an IC module is provided with an IC chip clamped by a pair of bases on a hybrid type information recording medium, and a protective layer is formed on the outer surface of the IC module, and the thickness of the protective layer is 0.5-1.5 times the thickness of the transparent base. |
