| 摘要 |
<p>The present invention relates to barrier coatings in particular in metallised substrates such as metallised papers, cards or boards. There is described a process for the preparation of a metallised substrate, the process comprising the steps of applying a water-based barrier composition to the substrate, allowing the composition to dry to form a barrier coating, and then applying a metal coating thereto. There is also described the use of a water-based barrier composition as a primer for a substrate in a metallisation process. Preferably, the barrier composition comprises a polymeric material selected from polyvinyl chlorides, polyacrylates and polymethacrylates; copolymers of vinyl chloride with vinyl acetate and optionally an unsaturated carboxylic acid; copolymers of styrene with butadiene and optionally acrylonitrile; copolymers of styrene with acrylonitrile; copolymers of acrylonitrile with butadiene; copolymers of styrene with an acrylate and/or methacrylate; polyvinylidene chloride; and copolymers of ethylene acrylic acid; or mixtures thereof.</p> |
