发明名称 |
Lead frame for semiconductor package and lead frame plating method |
摘要 |
A lead frame plating method including the steps of (a) forming an intermediate layer on the upper surface of a metal substrate, (b) submerging the metal substrate into a plating solution, and (c) forming a passive layer to a thickness of 0.01 to 1.5 microinches on the upper surface of the intermediate layer by applying a modulated current to the plating solution and the metal substrate.
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申请公布号 |
US6150713(A) |
申请公布日期 |
2000.11.21 |
申请号 |
US19990260471 |
申请日期 |
1999.03.02 |
申请人 |
SAMSUNG AEROSPACE INDUSTRIES, LTD. |
发明人 |
PARK, SE-CHUL;LEE, KYU-HAN;KIM, JU-BONG;KANG, SUNG-IL;SHIN, DONG-IL;JANG, BAE-SOON |
分类号 |
H01L23/50;H01L21/48;H01L23/495;(IPC1-7):H01L23/495 |
主分类号 |
H01L23/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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