发明名称 METHOD AND DEVICE FOR CHECKING THE OBLIQUE POSITION OR COPLANARITY OF A CONTACT BANK OF SMD COMPONENTS
摘要 Known methods for checking coplanarity of SMD components (1) verify individual contacts using a reflection method or a shadow-casting method and are therefore very time-consuming. According to the invention, an entire contact bank (2, 10, 13, 15) is illuminated in the direction of the contact bank (2, 10, 13, 15) and the shadow of the entire contact bank (2, 10, 13, 15) is detected in a line detector (5). Displacement of the contact bank (2, 10, 13, 15) causes the position (h) of the shadow on the line sensor (5) to be displaced and a change in the expansion (H) of the shadow. By determining the minimal expansion (Hm1..3) of the shadow, a quantity for the coplanarity of the contact bank (2, 10, 13, 15) is obtained from the minimal expansion (Hm1..3) itself and a data regarding the oblique position of the component (1) from the position (hm1..3) of the shadow with the minimal expansion (Hm1..3).
申请公布号 WO9962313(A2) 申请公布日期 1999.12.02
申请号 WO1999DE01240 申请日期 1999.04.27
申请人 SIEMENS AKTIENGESELLSCHAFT 发明人 WACKER, JOSEF;GRASMUELLER, HANS-HORST
分类号 G01B11/24;G01B11/30;H05K13/04;H05K13/08 主分类号 G01B11/24
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