发明名称 APPARATUS FOR THERMO COMPRESSION BONDING
摘要 PROBLEM TO BE SOLVED: To provide an apparatus for thermo compression bonding that does not exert an influence upon a polarizing plate or the like in a thermo compression bonding between a liquid-crystal display panel and a flexible wiring substrate, by lowering the setting temperature of a heater. SOLUTION: A heater bar 8 is formed of beryllium copper.
申请公布号 JP2002261127(A) 申请公布日期 2002.09.13
申请号 JP20010054747 申请日期 2001.02.28
申请人 OPTREX CORP 发明人 NAKADO HIROYUKI
分类号 G02F1/13;G02F1/1345;G09F9/00;H01L21/60;(IPC1-7):H01L21/60;G02F1/134 主分类号 G02F1/13
代理机构 代理人
主权项
地址