SEMICONDUCTOR APPARATUS AND ITS MANUFACTURING METHOD, SEMICONDUCTOR CHIP AND ITS MANUFACTURING METHOD, AND ELECTRONIC APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor apparatus which can excellently connect a semiconductor chip with an external substrate, or semiconductor chips with each other in a packaging of a semiconductor. SOLUTION: The method comprises the processes of: forming a first terminal 12a in a semiconductor chip 40; forming a second terminal 12b of smaller size at its tip; arranging the second terminal 12b and an external terminal so that they may contact with each other; and electrically connecting both through a conductive material (solder) 5. COPYRIGHT: (C)2005,JPO&NCIPI