SEMICONDUCTOR DEVICE HAVING TUBEROUS ELECTRODE AND SEMICONDUCTOR PACKAGE USING THE SAME

摘要

A semiconductor device and a semiconductor package using the same are provided to enhance electrode connection reliability between semiconductor devices by arranging a plurality of hemi-spherical protrusions on a surface of an electrode. A semiconductor device is boned to an upper surface or a lower surface of an adhesive film. The semiconductor device includes a plurality of electrodes spaced apart from each other. A plurality of hemi-spherical protrusions(111a) are arranged at one side of the electrode, wherein the electrode faces a bonding surface of the adhesive film. An NCF(Non-Conductive Film) is used as the adhesive film, wherein the NCF is made of an adhesive resin compound except conductive grains.