摘要 |
<p>A manufacturing apparatus of a semiconductor device, and a horizontality sensing method about the same are provided to detect horizontality of a bake plate and a chamber previously by forming a light receiving sensor at the bake plate, and forming a level detector at the chamber. A plate(202) comprises a sensing part(214) which is composed of a light receiving sensor(212) receiving a light emitted from a light emitting sensor(210). A wafer is loaded on the plate. A chamber(204) is located on the plate to provide a shielded space to the wafer, and comprises a reflective part which refracts the light emitted from the light emitting sensor and reflects it toward the light receiving sensor.</p> |