| 摘要 |
PROBLEM TO BE SOLVED: To obtain an electrical test method, in which a test procedure is simplified and the reliability of the test procedure can be improved by a method, wherein an IC package is mounted by using an anisotropic conductor, on an interconnection board for test. SOLUTION: An interconnection board 11, for test, which is provided with pads 12 for contact is covered with an adhesive anisotropic conductor 13 in the interface between an electric contact row and an adhesive layer by the anisotropic conductor 13. An IC device 14, which is provided with solder bump contacts 15, is bonded and arranged in a state such that the pads 12 for contact and the solder bump contacts 15 are aligned. The anisotropic conductor 13 contains normally spherical conductive particles 17 which are contained inside a polymer matrix. A pressure which is applied to the anisotropic conductor 13 is indicated by arrows 18, and the conductive particles 17 are trapped between contact surfaces so as to form a conductive path in the Z-axis direction. |
