| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a sealing method for a light emitting diode chip having high-efficiency light emission effect, and to provide a sealing structure thereof. <P>SOLUTION: The sealing method for the light emitting diode chip having high-efficiency light emission effect according to the present invention includes a substrate unit, a light emission unit, and a package colloid unit. The substrate unit among them has a substrate body, and a positive-electrode conductive trace and a negative-electrode conductive trace formed on the substrate body respectively. The light emission unit has a plurality of light emitting diode chips provided to the substrate body, and each of the light emitting diode chips has a positive-electrode terminal and a negative-electrode terminal electrically connected to the positive- and negative-electrode traces of the substrate unit. The package colloid unit has package colloid covering those light emitting diode chips. <P>COPYRIGHT: (C)2009,JPO&INPIT |
