| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a substrate dividing method that can suppress the degradation of coincidence between a predetermined divided shape and an actually divided substrate shape. <P>SOLUTION: The substrate dividing method has a reformed area forming process for forming a reformed area on the substrate 4 along a predetermined dividing line D set on the substrate 4 by irradiating laser light in the inside of the substrate 4, and a dividing process for dividing the substrate 4 by adding external force to the substrate 4 formed with the reformed area. The substrate dividing method further has a divided auxiliary area forming process for forming a divided auxiliary area which is an area of enhancing the fragility of the substrate 4 in the substrate 4, along a line that connects the reformed area to the end of the substrate 4. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
