发明名称 METHOD OF FORMING MICRO PATTERN AND METHOD OF MANUFACTURING MICRO PATTERN STRUCTURE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a micro pattern forming method for easily transferring a pattern with high accuracy from a substrate having a fine uneven pattern to another substrate. <P>SOLUTION: A dielectric film 15 is formed on a first substrate 11 having an uneven pattern at least on its one surface. The first substrate 11 and a second substrate 14 are coupled across a first ultraviolet curing resin 12 containing fluorine and a second ultraviolet curing resin 13 not containing fluorine in this order from the first substrate 11 side. The first substrate 11 and the second substrate 14 are separated from each other at the boundary between the dielectric film 15 and the first ultraviolet curing resin 12 containing fluorine, and the uneven pattern is transferred to the first ultraviolet curing resin 12 containing fluorine. <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP2010020842(A) 申请公布日期 2010.01.28
申请号 JP20080180534 申请日期 2008.07.10
申请人 NEC CORP 发明人 KARIYADA HIDETSUGU
分类号 G11B7/26;B29C33/38;B29C59/02;G11B5/84;G11B5/855;H01L21/027 主分类号 G11B7/26
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