| 主权项 |
1. A method for manufacturing a coreless package structure comprising:
providing a supporting substrate comprising an etching resist layer and a first copper foil; defining a groove in the first copper foil; forming a plurality of contact pads on a surface of the first copper foil; receiving a chip in the groove, the chip comprising a plurality of electrode pads on a side away from the etching resist layer; forming a packaging layer on a side of the first copper foil, the packaging layer covering the chip, the contact pads, and the first copper foil exposed from the contact pads; forming an insulating layer, a plurality of first conductive bumps, and a conductive pattern layer, the insulating layer adhered between the packaging layer and the conductive pattern layer, the conductive pattern layer electrically connected to the contact pads by the first conductive bumps, the conductive pattern layer electrically connected to the electrode pads by a plurality of second conductive bumps; and removing the etching resist layer and the first copper foil, thereby, obtaining a coreless package structure; wherein a method for forming the insulating layer, the first conductive bumps, the second conductive bumps, and the conductive pattern layer comprises: laminating a first laminating substrate on a side of the packaging layer away from the supporting substrate, the first laminating substrate comprising an insulating layer and a second copper foil, the insulating layer adhered between the packaging layer and the second copper foil; forming a plurality of first blind holes and a plurality of second blind holes defined by the second copper foil, the insulating layer, and the packaging layer by a laser drilling process, each of the contact pads corresponding to and exposed from one of the first blind holes, and each of the electrode pads corresponding to and exposed from one of the second blind holes; forming the first conductive bumps, the second conductive bumps, and a conductive layer by an electroless plating process and then an electro plating process, each of the first conductive bumps being formed in one of the first blind holes, and corresponding to and electrically connected to one of the contact pads, each of the second conductive bumps being formed in one of the second blind holes, and corresponding to and electrically connected to one of the electrode pads, the conductive layer covering a portion of the second copper foil, the conductive layer being electrically connected to the first conductive bumps and the second conductive bumps; and etching a portion of the second copper foil exposed from the conductive layer to obtain the conductive pattern layer. |
