Molecular self-assembly in substrate processing

摘要

Methods for sealing a porous dielectric are presented including: receiving a substrate, the substrate including the porous dielectric; exposing the substrate to an organosilane, where the organosilane includes a hydrolysable group for facilitating attachment with the porous dielectric, and where the organosilane does not include an alkyl group; and forming a layer as a result of the exposing to seal the porous dielectric. In some embodiments, methods are presented where the organosilane includes: alkynyl groups, aryl groups, fluoroalkyl groups, heteroaryl groups, alcohol groups, thiol groups, amine groups, thiocarbamate groups, ester groups, ether groups, sulfide groups, and nitrile groups. In some embodiments, method further include: removing contamination from the porous dielectric and a conductive region of the substrate prior to the exposing; and removing contamination from the conductive region after the forming.

主权项

1. A method comprising:
providing a substrate, wherein the substrate comprises a plurality of exposed dielectric surfaces and at least one exposed conductive surface; selectively forming a self-assembled layer on the plurality of exposed dielectric surfaces, wherein the self-assembled layer comprises one or more thiols and the forming of the self-assembled monolayer is performed using vapor deposition, wherein the one or more thiols are represented by R—SH, wherein R is an alkyl, an aryl, a heteroaryl, a fluorinated alkyl, a fluorinated aryl, a fluorinated heteroaryl, a functionalized alkyl, a functionalized aryl, or a functionalized heteroaryl; and wherein the one or more thiols are functionalized with an organo-metallic terminal group.