| 发明名称 | Heat sink in the aperture of substrate | ||
| 摘要 | A semiconductor package includes a support substrate arranged with a first aperture reaching a semiconductor device on a rear side, the semiconductor device is bonded via an adhesive to a surface of the support substrate, an insulating layer covering the semiconductor device, and wiring for connecting the semiconductor device and an external terminal through the insulating layer. The adhesive may form a part of the first aperture. In addition, a heat dissipation part may be arranged in the first aperture and a metal material may be filled in the first aperture. | ||
| 申请公布号 | US9362200(B2) | 申请公布日期 | 2016.06.07 |
| 申请号 | US201514744946 | 申请日期 | 2015.06.19 |
| 申请人 | J-DEVICES CORPORATION | 发明人 | Honda Hirokazu;Watanabe Shinji;Iwasaki Toshihiro;Ishido Kiminori;Niwa Koichiro;Miyakoshi Takeshi;Hosoyamada Sumikazu;Kumagaya Yoshikazu;Chikai Tomoshige;Nakamura Shingo;Sakumoto Shotaro;Matsubara Hiroaki |
| 分类号 | H01L23/12;H01L21/00;H01L23/367;H01L23/31;H01L23/498;H01L23/538;H01L23/40;H01L23/13 | 主分类号 | H01L23/12 |
| 代理机构 | Typha IP LLC | 代理人 | Typha IP LLC |
| 主权项 | 1. A semiconductor package comprising: a support substrate arranged with a first aperture reaching a semiconductor device on a rear side; the semiconductor device bonded via an adhesive to a surface of the support substrate; an insulating layer covering the semiconductor device; and a wiring on the insulating layer for connecting the semiconductor device and an external terminal via a contact hole in the insulating layer. | ||
| 地址 | Oita JP | ||