| 发明名称 | Dicing tape-integrated film for semiconductor back surface | ||
| 摘要 | The present invention provides a dicing tape-integrated film for semiconductor back surface, which includes: a dicing tape including a base material and a pressure-sensitive adhesive layer provided on the base material; and a film for flip chip type semiconductor back surface provided on the pressure-sensitive adhesive layer, in which the film for flip chip type semiconductor back surface contains a black pigment. | ||
| 申请公布号 | US9362156(B2) | 申请公布日期 | 2016.06.07 |
| 申请号 | US201414188991 | 申请日期 | 2014.02.25 |
| 申请人 | NITTO DENKO CORPORATION | 发明人 | Takamoto Naohide;Matsumura Takeshi;Shiga Goji |
| 分类号 | H01L23/48;H01L21/683;H01L21/67;H01L23/00 | 主分类号 | H01L23/48 |
| 代理机构 | Sughrue Mion, PLLC | 代理人 | Sughrue Mion, PLLC |
| 主权项 | 1. A dicing tape-integrated film for semiconductor back surface, comprising: a dicing tape comprising a base material and a pressure-sensitive adhesive layer provided on the base material; and a film for flip chip semiconductor back surface provided on the pressure-sensitive adhesive layer, wherein the film for flip chip semiconductor back surface contains a black pigment, the film for film for flip chip semiconductor back surface has a thickness of 2 to 200 μm, the film for flip chip semiconductor back surface has a moisture absorbance of 1% by weight or less when the film is allowed to stand under an atmosphere of temperature of 85° C. and humidity of 85% RH for 168 hours, and a ratio of a thickness of the film for flip chip semiconductor back surface to a thickness of the dicing tape is in a range of 150/50 to 3/500. | ||
| 地址 | Osaka JP | ||