发明名称 Method for processing a workpiece by forming a pourous metal layer
摘要 A method for processing a workpiece may include: providing a workpiece including a first region and a second region; forming a porous metal layer over the first region and the second region; wherein the first region and the second region are configured such that an adhesive force between the second region and the porous metal layer is lower than an adhesive force between the first region and the porous metal layer.
申请公布号 US9362127(B2) 申请公布日期 2016.06.07
申请号 US201313948208 申请日期 2013.07.23
申请人 Infineon Technologies AG 发明人 Krenzer Michael;Kunstmann Thomas;Hess Eva-Maria;Frank Manfred
分类号 H01L21/285;H01L21/02;H01L23/532 主分类号 H01L21/285
代理机构 Viering, Jentschura & Partner 代理人 Viering, Jentschura & Partner
主权项 1. A method for processing a workpiece, the method comprising: providing a workpiece comprising a first region and a second region; forming a porous metal layer over the first region and the second region; wherein the first region and the second region are configured such that an adhesive force between the second region and the porous metal layer is lower than an adhesive force between the first region and the porous metal layer, wherein at least one of the following conditions is satisfied: 1) the adhesive force between the second region and the porous metal layer is such that the porous metal layer detaches from the second region upon application of a force of less than or equal to about 50 kg/cm2 to the porous metal layer in a stamp pull-off test, 2) the adhesive force between the first region and the porous metal layer is such that the porous metal layer withstands a force of greater than or equal to about 100 kg/cm2 applied to the porous metal layer in a stamp pull-off test, without detaching from the first region.
地址 Neubiberg DE