Interposer and electronic component package

摘要

An interposer includes a wiring member including a first inorganic substrate, a reinforcement member including a second inorganic substrate, and an adhesive part interposed between the wiring member and the reinforcement member. Each of the first and second inorganic substrates includes first and second surfaces. Multiple inorganic insulating layers formed on the first surface of each of the first and second inorganic substrates have the same layer configuration and are arranged symmetrically in a vertical direction with the adhesive part centered therebetween. An inorganic insulating layer and an organic insulating layer formed on the second surface of each of the first and second inorganic substrates have the same layer configuration and are arranged symmetrically in the vertical direction with the adhesive part. An organic insulating layer formed on the second surface of each of the first and second inorganic substrates is an outermost insulating layer.

主权项

1. An interposer comprising:
a wiring member including a first inorganic substrate; a reinforcement member including a second inorganic substrate, the reinforcement member being formed on the first inorganic substrate; and an adhesive part interposed between the wiring member and the reinforcement member; wherein the first inorganic substrate includes a first surface on a side toward the adhesive part and a second surface on a side opposite of the first surface, wherein a plurality of inorganic insulating layers and a plurality of wiring layers are formed on the first surface of the first inorganic substrate, wherein an inorganic insulating layer, a wiring layer, and an organic insulating layer are formed on the second surface of the first inorganic substrate, wherein the second inorganic substrate includes a first surface on a side toward the adhesive part and a second surface on a side opposite of the first surface, wherein a plurality of inorganic insulating layers are formed on the first surface of the second inorganic substrate, wherein an inorganic insulating layer and an organic insulating layer are formed on the second surface of the second inorganic substrate, wherein the plurality of inorganic insulating layers formed on the first surface of the first inorganic substrate and the plurality of inorganic insulating layers formed on the first surface of the second inorganic substrate have the same layer configuration and are arranged symmetrically in a vertical direction with the adhesive part centered therebetween, wherein the inorganic insulating layer and the organic insulating layer formed on the second surface of the first inorganic substrate and the inorganic insulating layer and the organic insulating layer formed on the second surface of the second inorganic substrate have the same layer configuration and are arranged symmetrically in the vertical direction with the adhesive part; wherein the organic insulating layer formed on the second surface of the first inorganic substrate is an outermost insulating layer of the wiring member; wherein the organic insulating layer formed on the second surface of the second inorganic substrate is an outermost insulating layer of the reinforcement member.