发明名称 |
Electroless gold plating liquid |
摘要 |
The present invention relates to an electroless gold plating liquid, which may form gold plating without corrosion of a base metal by performing substitution and reduction reactions in the same bath, and satisfy both weldability of lead-free soldering and wire bonding characteristics, and has excellent stability such that a gold deposition rate may be continuously maintained. |
申请公布号 |
US9416453(B2) |
申请公布日期 |
2016.08.16 |
申请号 |
US201414578987 |
申请日期 |
2014.12.22 |
申请人 |
MK CHEM & TECH |
发明人 |
Lee Tae-Ho;Han Deok-Gon;Sung Tae-Hyun |
分类号 |
C23C18/44 |
主分类号 |
C23C18/44 |
代理机构 |
Nixon Peabody LLP |
代理人 |
Resnick David S.;Nixon Peabody LLP |
主权项 |
1. An electroless gold plating liquid comprising:
deionized water; a water-soluble gold compound; a complexing agent; a pH buffer; a pH control agent; a reductant; and a palladium ionic catalyst activator, wherein the palladium ionic catalyst activator is a carboxyl amide compound represented by the following Formula 1: where R′ and R″ are CH3, C2H5, CH2OH, or C2H4OH, and n is an integer in a range of 2 to 5. |
地址 |
Anyang-Si KR |