| 发明名称 |
Encapsulated microelectromechanical structure |
| 摘要 |
A semiconductor layer having an opening and a MEMS resonator formed in the opening is disposed between first and second substrates to encapsulate the MEMS resonator. An electrical contact that extends from the opening to an exterior of the MEMS device is formed at least in part within the semiconductor layer and at least in part within the first substrate. |
| 申请公布号 |
US9440845(B2) |
申请公布日期 |
2016.09.13 |
| 申请号 |
US201514961760 |
申请日期 |
2015.12.07 |
| 申请人 |
SiTime Corporation |
发明人 |
Partridge Aaron;Lutz Markus;Gupta Pavan |
| 分类号 |
H01L23/488;H01L23/051;B81B7/00;B81C1/00;H01L41/113 |
主分类号 |
H01L23/488 |
| 代理机构 |
|
代理人 |
Shemwell Charles |
| 主权项 |
1. A microelectromechanical system (MEMS) device comprising:
a semiconductor layer disposed between first and second substrate layers and having an opening therein; a MEMS resonator disposed within the opening in the semiconductor layer and encapsulated therein by the first and second substrate layers; and an electrical contact extending from the opening to an exterior of the MEMS device and formed at least in part by the semiconductor layer and the first substrate layer. |
| 地址 |
Sunnyvale CA US |
