SEMICONDUCTOR DEVICE COMPRISING A GLASS SUPPORTING BODY ONTO WHICH A SUBSTRATE WITH SEMICONDUCTOR ELEMENTS AND A METALLIZATION IS ATTACHED BY MEANS OF AN ADHESIVE

摘要

A semiconductor device comprising a glass supporting body (1) onto which an insulating substrate (3) is attached by means of a layer of an adhesive (2). This substrate is provided on the first side (4) facing the supporting body with a surface (5) on which a semiconductor element (7) is formed in a layer of a semiconductor material (6), and on which surface a metallization (8) with a pattern of conductor tracks (9, 10) is provided. An insulating layer (14) having a dielectric constant epsilon r below 3 is provided between the metallization (8) formed on the substrate and the layer of adhesive (2). By virtue of this additional layer (14), parasitic capacitances between the metallization (8) and the metallization in an envelope in which the device is accommodated or the metallization on a printed circuit board on which the device is mounted, are reduced substantially.