Resist compositions for plating

摘要

A resist composition for plating comprises a partial-acrylated, uncured novolac type epoxy resin as a photosensitive resin ingredient and an imidazole curing agent as a curing agent, wherein the imidazole curing agent is liquid at 25 DEG C. or the composition contains an acrylic ester polymer having a molecular weight of 500-5000. By using such a resist composition can be provided a printed wiring board having excellent conduction reliability and heat cycle property.