发明名称 Positioning system for test object carrier plate, e.g. for semiconductor devices - has carrier plate mounted on positioning device carrying connector block mounting sections and having positioning pins matching carrier plate holes
摘要 A positioning system for a test object carrier plate has several connector blocks (6, 15) with contact sensors (7) for contacting a carrier plate (10). The carrier plate is mounted on a positioning device (2) which carries the connecting block mounting sections (3A, 3B) and which positions the sensors to make contact with the carrier plate. The positioning device has positioning pins for accurate alignment with the carrier plate by interaction with corresp. matching bores in the carrier plate. USE/ADVANTAGE - E.g. for testing semiconductor devices. The positioning accuracy of a Device Under Test plate w.r.t. the test head is increased.
申请公布号 DE4207002(A1) 申请公布日期 1992.09.17
申请号 DE19924207002 申请日期 1992.03.05
申请人 HEWLETT-PACKARD CO., PALO ALTO, CALIF., US 发明人 NAGAKUSA, KEIICHI, TOKIO/TOKYO, JP;SHIRAISHI, TETSUYA, HACHIOJI, TOKIO/TOKYO, JP;TAMURA, TAKESHI, AKISHIMA, TOKIO/TOKYO, JP
分类号 G01R31/26;G01R31/28;H01L21/66 主分类号 G01R31/26
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