METHOD FOR BONDING METAL TO SOLID ELECTROLYTE

摘要

PURPOSE:To enhance a bonding strength between a solid electrolyte and a metal especially without requiring the atmosphere of a high temperature. CONSTITUTION:A metal layer 4 containing several wt.% of one or both of a copper material and a bismuth material is formed on a solid electrolyte 3, and subsequently the solid electrolyte 3 having the metal layer 4 is placed in a high temperature atmosphere to oxidize the copper or bismuth in the high temperature atmosphere. The oxide layer 5 formed on the interface between the solid electrolyte and the metal layer acts as a buffer layer for enhancing the bonding strength between the solid electrolyte 3 and the metal layer 4.