发明名称 |
BOTTOM LEAD SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME |
摘要 |
A bottom lead semiconductor package includes a plurality of bottom leads with inner leads extended upwardly bent or inclined from corresponding ones of the bottom leads. A semiconductor chip is attached to an upper surface of each of the bottom leads by a nonconductive adhesive, and a plurality of conductive wires electrically connects a plurality of chip pads on the chip to the inner leads. A molding compound forms a package body having a plurality of openings such that a lower surface of each of the bottom leads is externally exposed. The fabrication method includes a molding step for sealingly molding the package but exposing the lower surface of the bottom leads and the inner leads upwardly bent extending from corresponding ones of the bottom leads. A mold with a plurality of protrusions on a bottom surface in the mold and the protrusions respectively serve to fill openings formed below each of the inner leads to prevent the flow of molding resin into the openings. |
申请公布号 |
KR100237051(B1) |
申请公布日期 |
2000.01.15 |
申请号 |
KR19960075053 |
申请日期 |
1996.12.28 |
申请人 |
HYUNDAI MICRO ELECTRONICS CO.,LTD. |
发明人 |
KIM, MYUNG KI |
分类号 |
H01L23/28;H01L23/12;H01L23/31;H01L23/48;H01L23/495;H01L23/50;H05K3/34 |
主分类号 |
H01L23/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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