| 摘要 |
PURPOSE:To highly reliably connect electronic components at a small pitch by forming electrodes on one side in projecting shapes and electrodes on the other side in recessed shapes. CONSTITUTION:In the upper section of the electronic component, electrodes 3 formed in trapezoidal shapes by etching are connected to a base substrate 1 with a bonding agent 2. In the lower section of the electronic component, on the other hand, a substrate 4 is formed to have recessed section on its surface and electrodes 5 are formed in the recessed sections by plating, etc. After putting a bonding agent 7 containing conductive particles between the electrodes 3 and 5, the upper section of the electronic component is pressed against the substrate 4 and the bonding agent 7 is heated so as to connect the electrodes 3 and 5 to each other. Since the electrodes 5 are formed to the recessed shapes, both electrodes can be easily and accurately aligned and connected with each other at the time of connecting the electrodes 3 and 5 to each other with pressure. |
