| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface mounting type of part where solder plating is executed all over the surface of a lead part. SOLUTION: This part is molded in the specified shape of a lead frame by the die-cut of a band material (metallic plate) with a press. Next, the lead part of the lead frame is bent (primary bending), and then solder plating is applied to the lead frame. Next, an electric part is fixed to the lead frame, and the lead frame and the electronic part are insert-molded by resin. After insert molding, the lead part is further bent (secondary bending). |
