| 摘要 |
PROBLEM TO BE SOLVED: To secure stability in mounting by miniaturizing a high frequency component and preventing the shorter dimension of the longitudinal and lateral dimensions of the high frequency component from getting equal or longer by providing an external connecting electrode on one surface of the high frequency component and providing a ground electrode inside the high frequency component near the surface of the high frequency component opposed to the surface where the external connecting electrode is provided. SOLUTION: A high frequency component 10 is composed of a multilayer substrate 11 constituted by laminating a substrate material composed of ceramic or resin and a conductor through sheeting or screen printing. External connecting electrodes 15-3 to 15-4 are provided on one surface of the multilayer substrate 11 and a ground electrode 12 is provided inside the high frequency component 10 near the surface of the multilayer substrate 11 opposed to the surface where the external connecting electrodes 15-3 to 15-4 are provided. Concerning the high frequency component 10, a capacitor part 13 exists inside the multilayer substrate 11 eccentrically to the side of the ground electrode 12 in the laminating direction of the multilayer substrate 11 consisting of the high frequency component 10, and the ground electrode 12 is provided as one part of a capacitor electrode. |
