| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component recognizing device of high precision and reliability. SOLUTION: Related to an electronic component recognizing part 1, an electronic component P allocated at a specified place is irradiated with light, and reflected light from the electronic component P is made incident on an imaging element 3 through a mirror 10 provided in a case 2, and the image of the electronic component P is recognized by the imaging element 3. Here, a bonding agent S is provided between a side surface 21a of a recessed mirror housing part 21 provided in a case 2 and a side surface 10a of a mirror 10, and at a bottom part of the mirror housing part 21, a bonding agent flow-in groove 22 continuous from the side surface 21a of the mirror housing part 21 is provided. |
