Semiconductor module with improved heat dissipation; has power component and control component chip on fastening face of carrier

摘要

The module has power (2) and control (3) component chips on a carrier (15), which has a heat dissipation face, with its rear face contacting an external heat sink (22). The power and control components and carrier are sealed by shaped plastics. The opposite side edges of the flat carrier section are bent upwards to form a stronger section (16a). The carrier fastening face has a flat section for the power component and a control component section extending continuously from the flat carrier section.