发明名称 Nozzle touch apparatus for injection molding machine
摘要 <p>A nozzle touch apparatus for an injection molding machine comprises a frame; an injection apparatus having an injection nozzle, the injection apparatus being disposed to be movable relative to the frame; drive means for advancing and retracting the injection apparatus; conversion means for converting rotational force generated by the drive means to thrust force and for transmitting the thrust force to the injection apparatus; accumulation means disposed between the conversion means and the frame and adapted to accumulate nozzle touch force; and a buffer member disposed between the injection apparatus and the conversion means. In this case, variation in nozzle touch force due to overload can be adjusted by the action of the buffer member. Accordingly, when the buffer member is adjusted so as to reduce the variation in nozzle touch force due to overload, an excessively large nozzle touch force is not generated, so that breakage of the mold apparatus can be prevented. Further, in the case where a reaction force acting on the injection nozzle increases due to resin pressure during injection, when the buffer member is adjusted such that the nozzle touch force changes to a large extent, it becomes possible to prevent leakage of resin from the clearance between the injection nozzle and the mold apparatus. &lt;IMAGE&gt;</p>
申请公布号 EP0983835(A2) 申请公布日期 2000.03.08
申请号 EP19990116792 申请日期 1999.09.01
申请人 SUMITOMO HEAVY INDUSTRIES, LTD. 发明人 EMOTO, ATSUSHI
分类号 B29C45/07;B29C45/17;B29C45/20;B29C45/76;(IPC1-7):B29C45/20 主分类号 B29C45/07
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