发明名称 MOLD FOR MOLDING RESIN
摘要 PROBLEM TO BE SOLVED: To make a temperature of a mold body 31 uniform and to improve a quality of a resin molding W. SOLUTION: Metal particles 53A to 53C for constituting a sintered metal layer 34 are continuously or stepwisely changed in a particle size along a flow of a heating medium so as to become small at a water input port 36 side of a heating medium and large at a drain port 37 side. Thus, a flow of the medium is, for example, fine at the port 36 side and thick at the drain port 37 side to make a temperature of the body 31 uniform.
申请公布号 JP2001347527(A) 申请公布日期 2001.12.18
申请号 JP20000174524 申请日期 2000.06.09
申请人 HONDA MOTOR CO LTD 发明人 KIMURA MIKIHIKO;UEHA FUMITO;TSUJI MASATERU
分类号 B29C33/02;B29C45/73;(IPC1-7):B29C33/02 主分类号 B29C33/02
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