| 摘要 |
PROBLEM TO BE SOLVED: To prevent gold wires 30a, 30b, and 30c from breaking. SOLUTION: When the semiconductor device is molded, recesses 24a and 24b are filled with molding resin, which insulates a die-bonding region 20 and wire-bonding regions 22a and 22b. The die bonding region 20 and wire bonding regions 22a and 22b are expanded thermally individually at rates corresponding to their thermal expansion coefficients, and the quantity of displacement resulting from the thermal expansion of the wire-bonding regions 22a and 22b becomes small. Namelly, the quantity of relative slide between the wire bonding regions 22a and 22b and molding resin becomes small, and the shearing force operating on their interface becomes small.
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