| 摘要 |
<p>PURPOSE:To contrive to reduce cost by performing a stable chemical W-reaction and grinding process, the process time, the number of step, and reduce cost by simplifying control in a method of manufacturing a semiconductor device when a semiconductor substrate is flatted in the semiconductor device. CONSTITUTION:A plate 33 providing an abrasive cloth 34 is arranged within a treatment tank 32 and a ring 35 for once holding solvents 38a, 38b is provided surrounding the plate 33. Further, a rotation head 36 chucking a semiconductor substrate 37 is supplying with a solvent 38a, a second nozzle 40 for supplying with a solvent 38b that is adjusted in temperature, and a temperature sensor 45 for detecting an increase in temperature by a chemical reaction are provided.</p> |
