| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin board with metal foil, and an electronic component, in which the metal foil can be polished conveniently and accurately up to a specified film thickness by providing the metal foil with a mark indicative of the specified film thickness and a fine circuit pattern can be formed with high accuracy. SOLUTION: After holes 2a, 2b and 2c of a specified depth shallower than the film thickness are made in a metal foil 1 of copper, or the like, the metal foil 1 is laid on a resin substrate 3 such that the bored surface abuts against the resin substrate 3 thus constituting a resin board with metal foil 11. When the surface of the metal foil is polished until the hole parts are exposed, a resin board provided with a metal foil having a uniform film thickness equal to the depth of the hole part is obtained, and an electronic component having a micromachined pattern can be produced easily.
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