| 摘要 |
PROBLEM TO BE SOLVED: To provide a bond pad supporting structural body to be used for an integrated circuit having a bond pad positioned on this. SOLUTION: A bond pad supporting structural body 300 is positioned under a bond pad, provided with a supporting layer having plural openings 310-360 formed inside, and positioned on a dielectric layer. Also, the dielectric layer extended at least partially in the openings 310-360 is included for forming a bond pad supporting face in at least one part of the openings. One part of the openings 310-360 of the bond pad supporting structure 300 is filled with the dielectric layer being the second bond pad supporting layer in this unique structural body. Thus, it is possible to form an inclined synthetic supporting structural body acting as a differential force transducer, in response to an inside stress and a bonding stress in the integrated circuit according to the cooperation of the structural bodies of those two layers. |
