SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To realize high speed transmission of a signal between a semiconductor device and outside equipment while miniaturizing the semiconductor device. SOLUTION: An element electrode 11 for a high speed signal and an element electrode 12 for a normal signal connected electrically to the semiconductor device are formed on a semiconductor board 10 providing the semiconductor device, and a low elastic modulus layer 14 is formed to cover each element electrode. A land 22 for the high speed signal connected to the element electrode 11 for the high speed signal 11 through a first opening part 14a is formed just above the element electrode 11 for the high speed signal. A land 23 for the normal signal 23 and connected wiring 24 whose one end is connected to the element electrode 12 for the normal signal through a second opening part 14b and whose other end is connected to the land 23 for the normal signal are formed.