发明名称 POLISHING PAD AND POLISHING METHOD
摘要 PROBLEM TO BE SOLVED: To hold slurry to be discharged out of a polishing pad by a slurry hold body once at the time of polishing by forming at least a part of a polishing face side where an object to be polished is polished by the slurry hold body. SOLUTION: A slurry hold body 14 is provided in a recessed part 13 to hold slurry once and efficiently in a polishing pad 11 provided with the recessed part 13 on a polishing face 12 side where an object to be polished is polished. In this case, the slurry hold body 14 is made of, for example, a material in which multiporous resin and fiberlike resin are accumulated in layers and a material in which fiberlike resin or pleatlike resin is densely provided in a bottom part of the recessed part 13, and the recessed part 13 is formed toward an outer peripheral direction from a central part of the polishing pad 11.
申请公布号 JP2000033553(A) 申请公布日期 2000.02.02
申请号 JP19990002413 申请日期 1999.01.08
申请人 SONY CORP 发明人 NAKAJIMA HIDEHARU
分类号 B24B37/20;B24B37/24;B24B37/26;H01L21/304 主分类号 B24B37/20
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