| 摘要 |
PROBLEM TO BE SOLVED: To prevent damage, disconnection, short, or deformation for a light- emitting diode chip and bonding wire when manufacturing a light-emitting diode device for wavelength-conversion of the light generated from a light- emitting diode chip. SOLUTION: A process where a phosphor layer 12 comprising a fluorescent material which absorbs the light emitted from a light-emitting diode chip 2 and converts it to the other luminous wavelength is formed of a phosphor chip, a process where the phosphor layer 12 is bonded to the light-emitting diode chip 2 through a translucent bonding agent before or after the light-emitting diode chip 2 is bonded to one end part of wiring conductors 3 and 4, and a process where the phosphor layer 12 along with the light-emitting diode chip 2 are coated with a sealing resin 8, are provided. |
