| 摘要 |
PROBLEM TO BE SOLVED: To reduce the size of a semiconductor element housing package having a coaxial connector to which a coaxial cable is connected and, at the same time, to make the package mass-produceable, and to improve the transmission efficiency for high-frequency signals of the package. SOLUTION: The semiconductor element housing package is provided with a substrate 1 having a placing section 1a for placing a semiconductor element 5, a frame 2 having a through hole or notch in its side, and a cylindrical member 30 fitted in the through hole or notch and housing the coaxial connector 3 in its inner peripheral surface. The cylindrical member 30 is composed of a narrow section 31 fitted in the through hole or notch of the frame 2 and a broad section 32 positioned on the outside of the external surface of the frame 2. At the same time, the cylindrical member 30 has a small-diameter section 35 in which the coaxial connector 3 is fitted from the narrow section 31 to the broad section 32, and a large-diameter section 36 which is coaxially connected to the small-diameter section 35 in the broad section 32 and in which a metallic cylindrical fixing member 9 which fixes the coaxial cable 10 electrically connected to the coaxial connector 3 is fitted. COPYRIGHT: (C)2005,JPO&NCIPI |
